ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：CONN AMC B+ FEMALE 170POS 0.029
- Series：AdvancedTCA
- Mfr：TE Connectivity AMP Connectors
- Package：Bulk
- Card Type：Advanced Mezzanine Card B+, MicroTCA
- Gender：Female
- Number of Positions/Bay/Row：85
- Number of Positions：170
- Card Thickness：0.063" (1.60mm)
- Number of Rows：2
- Pitch：0.029" (0.75mm)
- Read Out：Dual
- Features：-
- Mounting Type：Through Hole, Right Angle
- Termination：Press-Fit
- Contact Material：Copper Alloy
- Contact Finish：Gold or Gold-Palladium
- Contact Finish Thickness：-
- Contact Type：-
- Color：Black
- Flange Feature：-
- Operating Temperature：-
Download product information
Overview
The TE Connectivity AMP Connectors part number 1-1367703-1 is a 170-position female card edge connector designed for Advanced Mezzanine Card (AMC) B+ and MicroTCA applications. It features through-hole mounting with right-angle orientation and utilizes press-fit termination. The contacts are made of copper alloy with gold or gold-palladium finish.
Feature Summary
- Designed specifically for AMC B+ and MicroTCA mezzanine card applications
- Utilizes press-fit termination for secure board connection
- Features right-angle through-hole mounting configuration
Applications
- Advanced Mezzanine Card (AMC) B+ systems
- MicroTCA chassis implementations
- High-density mezzanine interconnects
Procurement Notes
Verify the specific contact finish requirement, as the component supports both gold and gold-palladium options. Confirm that the press-fit termination method aligns with the target PCB manufacturing capabilities. Ensure the right-angle through-hole mounting style matches the mechanical design constraints of the assembly.
Selection Notes
Select this connector when designing for AMC B+ or MicroTCA standards requiring high pin counts. The 170-position count supports complex signal routing. Verify compatibility with the specific card edge thickness and guide rail requirements associated with these mezzanine form factors.
Part Context
This component belongs to the TE Connectivity AMP Connectors portfolio specializing in high-reliability interconnect solutions. It serves as a critical interface between carrier boards and mezzanine cards in telecommunications and industrial computing environments where space efficiency and signal integrity are paramount.
Replacement Considerations
Consult official TE Connectivity documentation for verified substitute part numbers within the same series. Cross-reference mechanical dimensions and electrical specifications before considering alternative sources.
