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Product Detailed Parameters
- Description：M.2 0.5PITCH 3.2H KEY M GOLDFLAS
- Series：*
- Mfr：TE Connectivity AMP Connectors
- Package：Tape & Reel (TR)
- Card Type：-
- Gender：-
- Number of Positions/Bay/Row：-
- Number of Positions：-
- Card Thickness：-
- Number of Rows：-
- Pitch：-
- Read Out：-
- Features：-
- Mounting Type：-
- Termination：-
- Contact Material：-
- Contact Finish：-
- Contact Finish Thickness：-
- Contact Type：-
- Color：-
- Flange Feature：-
- Operating Temperature：-
Download product information
Overview
The TE Connectivity AMP Connectors part number 1-2199119-3 is a female connector designed for M.2 (NGFF) Mini Card applications. It features 67 positions with a 0.020 inch (0.50mm) pitch and gold-plated contacts. The component utilizes a thermoplastic housing, operates within a temperature range of -40°C to 80°C, and supports surface mount installation.
Feature Summary
- Designed specifically for M.2 (NGFF) Mini Card edge connections
- Features gold-plated contacts for reliable signal transmission
- Supports surface mount technology with right-angle orientation
Applications
- M.2 module interconnection
- NGFF mini card integration
- High-end application board-to-card connectivity
Procurement Notes
Verify the specific suffix against official documentation to confirm exact plating thickness and material composition. Ensure compatibility with single-sided module requirements as specified in the application specification. Cross-reference datasheet revision levels to confirm current manufacturing status and compliance with RoHS standards before finalizing procurement orders.
Selection Notes
Select this component when a 67-position female interface is required for M.2 modules. Confirm that the 0.50mm pitch aligns with the target PCB layout. Verify that the operating temperature range meets system environmental constraints. Ensure the surface mount package type matches the assembly process capabilities.
Part Context
This connector belongs to the M.2 (NGFF) product family from TE Connectivity AMP Connectors. It serves as a critical interface for next-generation form factor cards, providing high-density connectivity in compact electronic systems. The design supports modern computing and storage architectures requiring reliable edge card connections.
Replacement Considerations
Consult official substitution lists for equivalent parts. Verify mechanical dimensions and electrical characteristics match before swapping components.
