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The Amphenol ICC (FCI) 10018783-00113TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 164 positions with a 1.00 mm pitch, accommodating a board thickness of 2.36 mm. The connector utilizes copper alloy contacts with gold plating and a nylon housing. Rated for 1.1 A current and 300 VAC voltage, it supports high-speed signal integrity requirements for PCIe applications.
Verify the specific suffix 'TLF' against official Amphenol documentation to confirm lead-free compliance and packaging details. Ensure the requested quantity matches the manufacturer's standard factory pack size. Confirm that the 164-position variant aligns with the target PCB design specifications before finalizing the order.
Select this component when a vertical, through-hole PCIe Gen 3 interface is required for 2.36 mm thick boards. The 164-position count suits specific bandwidth needs. Verify compatibility with mating card edge thicknesses and ensure the 1.00 mm pitch fits the existing layout constraints compared to other series variants.
This part belongs to the Amphenol FCI PCIe Gen 3 series, engineered for robust signal integrity in demanding environments. The 10018783 series provides standardized connectivity solutions for next-generation computing platforms, balancing mechanical durability with high-frequency electrical performance requirements.
Direct substitutes include the 10018783-00103TLF, which shares the same series characteristics but may differ in position count or specific mechanical tolerances. Cross-reference official substitution lists to ensure pinout and form-factor compatibility.