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The Amphenol ICC (FCI) 10018784-10013MLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 98 positions with a 1.00 mm pitch, supporting high-speed signal transmission at 8.0 Gb/s per differential pair. The component utilizes gold-plated copper alloy contacts and a black nylon insulation housing to ensure reliable connectivity in demanding environments. Rated for 1.1 A current, it accommodates PCB thicknesses of 2.36 mm and operates within a temperature range of -55°C to 85°C.
Verify the specific suffix 'MLF' against official manufacturer documentation to confirm lead-free compliance and packaging specifications. Ensure the requested quantity matches standard reel sizes if applicable. Cross-reference the full part number with the latest datasheet revision to confirm material composition and RoHS status prior to finalizing procurement orders.
Select this connector when a vertical form factor is required for PCIe Gen 3 applications. The 98-position count suits specific bandwidth requirements between x8 and x16 configurations. Verify that the host PCB stack-up supports the specified 2.36 mm thickness and that the mating card dimensions align with the 1.00 mm pitch constraints for proper engagement.
This component belongs to the Amphenol FCI PCIe Gen 3 card edge connector family, engineered for robust signal integrity in enterprise and consumer electronics. The series offers various position counts to accommodate different lane widths, from x1 to x16. This specific model provides a balanced solution for applications needing reliable vertical interconnection without occupying excessive board space.
Consult official substitution guides for equivalent connectors within the same PCIe Gen 3 vertical through-hole category. Ensure any alternative maintains identical pin count, pitch, and mounting orientation. Verify that substitute parts meet the same thermal and current rating requirements for system compatibility.