10018784-10211MLF

Overview

The Amphenol ICC (FCI) 10018784-10211MLF is a high-speed card edge connector designed for PCI Express Gen 3 applications. It features a vertical through-hole mounting style with 98 positions and a 1.56 mm board thickness compatibility. The component utilizes gold-plated copper alloy contacts to ensure reliable signal integrity in demanding environments.

Feature Summary

• Supports high-speed 64Gb/s PAM4 design suitable for next-generation servers and storage systems
• Features 1mm pitch configuration with dedicated high-speed signal pins
• Vertical through-hole installation ensures secure mechanical attachment

Applications

• Next-generation server motherboards
• High-performance storage subsystems
• Data processing equipment requiring PCIe Gen 3 interfaces

Procurement Notes

Verify the specific suffix MLF against official Amphenol documentation to confirm material composition and plating specifications. Ensure the ordering part number matches the required contact count and pitch dimensions before procurement to avoid integration errors.

Selection Notes

Select this connector when designing systems requiring 64Gb/s PAM4 signal transmission capabilities. Confirm that the PCB stack-up supports the specified 1.56 mm thickness and that the vertical form factor aligns with the enclosure constraints of the target hardware application.

Part Context

This component belongs to the Amphenol FCI portfolio, which provides interconnect solutions for information and communication markets. The manufacturer specializes in signal integrity performance and power management technologies for commercial electronic devices.

Replacement Considerations

Consult official substitution guides for compatible alternatives within the same series. Verify pinout compatibility and electrical ratings before replacing with other models.