10108777-10103TLF

Overview

The Amphenol ICC (FCI) 10108777-10103TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 164 positions with a 1.00mm pitch, supporting high-speed data transmission standards. The connector utilizes gold-plated copper alloy contacts to ensure reliable signal integrity and low contact resistance in demanding applications.

Feature Summary

• Supports PCI Express Gen 3 specifications for enhanced bandwidth
• Vertical orientation facilitates efficient board space utilization
• Through-hole termination provides robust mechanical stability

Applications

• High-performance computing systems
• Telecommunications infrastructure equipment
• Industrial control modules requiring PCIe expansion

Procurement Notes

Verify the specific suffix against the manufacturer's current datasheet to confirm pinout and plating variations. Ensure compatibility with the target PCB stack-up thickness before finalizing procurement orders.

Selection Notes

Select this component when a 164-position vertical interface is required for Gen 3 signaling. Confirm that the 1.00mm pitch aligns with the mating card edge design and that the through-hole footprint matches the assembly capabilities.

Part Context

This part belongs to the Amphenol FCI portfolio of high-reliability interconnect solutions. It serves as a critical interface for expanding system capabilities within server and network hardware architectures.

Replacement Considerations

Consult official substitution guides for direct equivalents. Verify pin-to-pin compatibility and electrical ratings before integrating alternative sources into existing designs.