10114587-001LF

Overview

The Amphenol ICC (FCI) 10114587-001LF is a vertical edge connector designed for through-hole mounting. It features a dual female configuration with 60 positions, arranged in two rows. The connector utilizes a mixed pitch design, incorporating both 2.54 mm and 1.27 mm spacing to accommodate power and signal contacts efficiently. Each power contact beam supports a current rating of 9 A. The housing is black, and the component complies with RoHS3 standards.

Feature Summary

• Dual row female edge connector architecture supporting mixed pitch configurations
• Through-hole mounting method ensuring secure board attachment
• Power contact beams rated for 9 A current handling capacity

Applications

• High-density circuit board interconnection systems
• Industrial control module backplanes
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific pinout configuration against system schematics to ensure compatibility with mixed pitch requirements. Confirm that the vertical mounting orientation aligns with mechanical constraints. Check for RoHS3 compliance documentation if environmental regulations apply. Ensure the 9 A per power beam rating meets the thermal and electrical load demands of the target application without derating issues.

Selection Notes

Select this component when a vertical edge interface with mixed signal and power density is required. The dual-row layout optimizes space on the printed circuit board. Consider the 2.54 mm and 1.27 mm pitch combination for integrating different contact types within a single connector footprint. Evaluate the through-hole termination method for robust mechanical stability compared to surface mount alternatives.

Part Context

This part belongs to the Amphenol ICC vertical edge connector series, which provides reliable interconnect solutions for demanding electronic environments. The 10114587-001LF specifically addresses applications needing high current capacity alongside dense signal routing. Its design reflects industry trends toward compact, high-performance connectors for modular hardware architectures.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.