10118868-004LF

Overview

The Amphenol ICC (FCI) 10118868-004LF is a high-density card edge connector designed for PCIe M.2 Gen 5 applications. It features a dual female configuration with 40 positions and a precise 0.50mm pitch. The component utilizes gold plating on contact surfaces to ensure reliable signal integrity in high-speed data transmission environments. This connector supports various height options ranging from 4.2mm to 8.5mm, accommodating diverse board stack-up requirements while maintaining mechanical stability.

Feature Summary

• Dual female card edge interface optimized for high-speed data transfer
• Gold-plated contacts enhance conductivity and corrosion resistance
• Compact 0.50mm pitch design maximizes connection density
• Supports multiple board thickness configurations via variable heights

Applications

• PCIe M.2 Gen 5 storage modules
• High-performance computing expansion cards
• Data center accelerator boards
• Next-generation mobile device connectivity solutions

Procurement Notes

Verify the specific height variant required for your application, as the series offers options between 4.2mm and 8.5mm. Confirm that the dual female configuration aligns with your mating card specifications. Ensure compliance with RoHS directives if operating in regulated markets. Cross-reference the official datasheet for precise mechanical dimensions and soldering profile recommendations before finalizing procurement orders.

Selection Notes

Select this connector when designing systems requiring high-bandwidth data transmission with minimal footprint constraints. The 0.50mm pitch allows for significant I/O density improvements over standard connectors. Consider the available height variations to match the target PCB assembly tolerances. Evaluate thermal management needs, as high-density interfaces can generate concentrated heat during operation.

Part Context

This component belongs to the PCIe M.2 Gen 5 High-Density Card Edge connector family from Amphenol FCI. The manufacturer specializes in advanced interconnect solutions for information technology and communication markets. The product line focuses on delivering superior signal integrity and power delivery capabilities for modern electronic devices requiring rapid data exchange.

Replacement Considerations

Direct substitutes must maintain the 40-position count, 0.50mm pitch, and dual female topology. Verify compatibility with existing PCB footprints and mating card profiles. Alternative components should offer similar gold plating standards and height variations to ensure seamless integration without redesigning the host board layout.