10121505-160012BLF

Overview

The Amphenol ICC (FCI) part number 10121505-160012BLF is a dual-edge female edgeboard connector belonging to the HPCE series. It features 28 positions, configured as 12 signal and 16 power contacts. The connector utilizes a 2.54 mm pitch and employs a press-fit termination method for vertical mounting on printed circuit boards. The housing is constructed from black thermoplastic material, providing structural integrity and insulation. Contact surfaces are finished with tin-lead plating to ensure reliable electrical conductivity and corrosion resistance.

Feature Summary

• Dual-edge configuration supporting both signal and power transmission simultaneously
• Press-fit termination technology ensures secure mechanical attachment without soldering
• Black thermoplastic housing provides durable insulation and environmental protection
• Tin-lead contact plating offers robust conductivity and long-term reliability

Applications

• High-performance computing systems requiring dense interconnects
• Telecommunications infrastructure equipment
• Industrial control modules with mixed signal and power needs
• Data processing hardware utilizing HPCE series standards

Procurement Notes

Verify the specific suffix BLF against official Amphenol documentation to confirm the tin-lead plating specification and housing color. Ensure compatibility with the target board thickness of 0.062 inches (1.57mm). Confirm that the manufacturing source is authorized to guarantee genuine component quality and adherence to RoHS exemptions where applicable for leaded finishes.

Selection Notes

Select this component when a dual-edge solution is required to separate signal and power domains within a single connector footprint. The 2.54 mm pitch accommodates standard high-density board layouts. Verify that the system design supports press-fit assembly processes rather than wave or reflow soldering. Consider the operating temperature range of -55°C to +105°C for environmental suitability in demanding applications.

Part Context

This connector is part of the HPCE (High Performance Card Edge) family from Amphenol ICC (FCI), now under Amphenol Corporation. The HPCE series is engineered for high-speed data transmission and power delivery in compact form factors. This specific model integrates multiple rows to maximize connectivity density while maintaining signal integrity through precise geometry and material selection.

Replacement Considerations

Cross-reference with other HPCE series variants such as 10121505-320424DLF for different position counts. Ensure any substitute maintains the same 2.54 mm pitch and dual-edge architecture. Verify that alternative parts support the required press-fit termination and compatible board thickness specifications.