10122238-320424ALF

Overview

The Amphenol ICC (FCI) part number 10122238-320424ALF is a dual-sided card edge connector designed for through-hole mounting. It features 60 total positions, configured as 24 signal and 36 power contacts across two rows. The connector utilizes a GXT gold plating finish on the contact surfaces to ensure reliable electrical performance. It is engineered for non-specified double-edge card applications with a standard board thickness of 0.062 inches (1.57mm). The housing is constructed from black thermoplastic material, providing structural integrity and insulation.

Feature Summary

• Dual female contact configuration supporting both signal and power transmission
• Through-hole termination method ensuring secure mechanical attachment
• Integrated board lock feature for enhanced stability during operation

Applications

• High-performance computing systems requiring robust interconnects
• Server backplane architectures utilizing double-edge cards
• Industrial control modules demanding high pin count connectivity

Procurement Notes

Verify that the target printed circuit board design accommodates the specific 0.062-inch thickness requirement for proper mating. Confirm that the assembly process supports through-hole soldering techniques compatible with the connector's termination style. Ensure that the application environment remains within the specified operating temperature range to maintain material integrity and contact reliability over the product lifecycle.

Selection Notes

Select this component when a high-density dual-row interface is required for non-specified double-edge cards. The choice is appropriate for designs needing distinct separation between signal and power lines within a compact footprint. Consider the GXT plating specification if long-term corrosion resistance and low contact resistance are critical for the intended operational environment.

Part Context

This connector belongs to the HPCE series, which represents Amphenol ICC's solutions for high-performance computing environments. The series focuses on delivering superior signal integrity and power management capabilities. Components in this line are typically utilized in demanding data center and enterprise infrastructure applications where reliability under thermal stress is paramount.

Replacement Considerations

Consult official cross-reference documentation for direct substitutes. Verify that any alternative maintains identical row count, pin configuration, and board thickness compatibility.