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The Amphenol ICC (FCI) part number 10127242-003LF is a rectangular header connector belonging to the Minitek Power 3.0 series. It features a dual-row configuration with three positions and a 3 mm pitch. Designed for through-hole mounting, this component utilizes copper contacts with tin plating to ensure reliable electrical performance. The housing is constructed from black Liquid Crystal Polymer (LCP), providing robust insulation and thermal stability. Rated for 8.5 A current and 600 VAC voltage, it operates within a temperature range of -40°C to +105°C. This straight-mount header serves as a critical interface for power distribution in compact electronic assemblies.
Verify the specific contact plating and row configuration against project requirements before ordering. Confirm that the through-hole mounting style aligns with the target PCB assembly process. Ensure environmental ratings meet operational temperature constraints. Cross-reference the manufacturer's latest documentation to confirm active status and compliance with current regulatory standards.
Select this component when a low-profile, high-current power header is required for board-to-board or cable-to-board applications. The 3 mm pitch allows for substantial conductor spacing, reducing arcing risks in high-voltage scenarios. Consider the tin-plated variant for general-purpose use where cost-effectiveness is prioritized over extreme corrosion resistance.
This connector belongs to the Minitek Power 3.0 family, engineered for demanding power delivery applications. The series is characterized by its compact form factor and ability to handle significant current loads within restricted spaces. As part of the Amphenol FCI portfolio, it leverages established manufacturing precision for consistent quality across global supply chains.
Direct substitutes must match the 3 mm pitch, dual-row layout, and 3-position count. Verify that alternative headers support the same 8.5 A current rating and 600 VAC insulation level. Ensure compatible through-hole termination methods and LCP housing materials for equivalent thermal performance.