10129174-001LF

Overview

The Amphenol ICC (FCI) 10129174-001LF is a dual-sided card edge connector designed for high-performance computing environments. It features 28 positions with a 2.54 mm pitch, utilizing a Type II termination style suitable for surface mount assembly. The housing is constructed from thermoplastic material, providing structural integrity and insulation resistance of 500 MOhms at 5 GOhms. This component belongs to the HPCE series, engineered for reliable signal transmission in demanding applications.

Feature Summary

• Dual-sided contact configuration for enhanced connectivity density
• Thermoplastic housing material ensuring stable insulation properties
• Designed for high-performance computing edge board applications

Applications

• High-performance computing server backplanes
• Edge board interconnects in data center infrastructure
• Signal distribution modules requiring robust card edge connections

Procurement Notes

Verify the specific datasheet version and pinout configuration against your PCB design requirements before procurement. Confirm that the thermal profile during soldering aligns with the manufacturer's recommendations for this thermoplastic housing type. Ensure compatibility with mating card edge thickness specifications defined in the official documentation to guarantee proper mechanical engagement and electrical continuity.

Selection Notes

Select this component when a dual-sided, 28-position connection is required for high-density signal routing. The 2.54 mm pitch offers standard spacing for compatible mating connectors. Consider the surface mount termination style for automated assembly processes. Verify that the operating temperature range of -65°C to 125°C meets the environmental conditions of the target application system.

Part Context

This part belongs to the HPCE series by Amphenol ICC (FCI), a line specialized for high-performance computing interconnects. The series focuses on providing reliable signal paths in dense electronic assemblies. The 10129174-001LF specifically addresses the need for dual-sided connectivity within this product family, supporting modern computing architectures that require robust physical layer connections.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Consult the manufacturer directly for potential obsolescence management or alternative solutions if this specific part number becomes unavailable.