10138327-10100TLF

Edgeboard Connectors Overview

The Amphenol ICC (FCI) part number 10138327-10100TLF is a PCI Express card edge connector designed for vertical through-hole mounting. It features a 36-position configuration with a 100mm pitch, specifically engineered to support PCI Express Gen 3 interface standards. This component facilitates reliable electrical connections between the motherboard and expansion cards in high-speed data processing applications.

Edgeboard Connectors Feature Summary

• Supports PCI Express Gen 3 interface specifications
• Vertical through-hole mounting design
• 36-position contact array

Edgeboard Connectors Applications

• PCI Express expansion slot implementations
• High-speed data processing systems
• Computer hardware motherboards

Edgeboard Connectors Procurement Notes

Verify the exact pin count and pitch against the official datasheet before procurement. Confirm RoHS compliance status and lead-free requirements. Ensure the vertical orientation matches the mechanical constraints of the target enclosure. Cross-reference the full part number to avoid confusion with similar series variants.

Edgeboard Connectors Selection Notes

Select this connector when a 36-position vertical interface is required for PCI Express Gen 3 signals. The through-hole construction provides robust mechanical stability compared to surface mount alternatives. Evaluate the 100mm pitch requirement against existing board layout constraints to ensure proper alignment with mating edge cards.

Edgeboard Connectors Part Context

This component belongs to the Amphenol ICC (FCI) PCI Express connector family. The manufacturer, formerly FCI and acquired by Amphenol, specializes in high-performance interconnect solutions. This specific model addresses the demand for reliable, high-bandwidth connectivity in modern computing infrastructure and peripheral expansion architectures.

Edgeboard Connectors Replacement Considerations

Consult official substitution guides for compatible 36-position PCI Express connectors. Verify that any alternative maintains the same vertical through-hole profile and 100mm pitch. Ensure signal integrity specifications match Gen 3 requirements before considering cross-brand replacements.