10139967-102MLF

Edgeboard Connectors Overview

The 10139967-102MLF is a PCI Express Gen 3 card edge connector manufactured by Amphenol ICC (FCI). It features a vertical surface mount design with 98 positions and a 1.00mm pitch. The connector utilizes gold-plated contacts to ensure reliable signal integrity for high-speed data transmission. Designed for robust performance in demanding environments, it supports the electrical requirements of modern computing systems.

Edgeboard Connectors Feature Summary

• Supports PCI Express Gen 3 high-speed data transfer standards
• Vertical surface mount configuration for efficient board space utilization
• Gold-plated contact surfaces for enhanced conductivity and corrosion resistance

Edgeboard Connectors Applications

• High-performance computing systems
• Server backplane interconnects
• Data communication equipment

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix against official Amphenol documentation to confirm exact pin count, plating specifications, and mechanical tolerances. Ensure compatibility with mating card edge thicknesses and verify that the vertical orientation matches the target PCB assembly constraints before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this component when a vertical form factor is required for PCI Express Gen 3 applications. Evaluate the 1.00mm pitch against available board routing density. Confirm that the surface mount technology aligns with the manufacturing process capabilities and thermal profiles of the production line.

Edgeboard Connectors Part Context

This part belongs to the Amphenol ICC (FCI) portfolio of high-reliability interconnect solutions. As an established manufacturer, FCI provides engineered components designed for rigorous industrial and commercial standards. This specific model represents a specialized solution within their card edge connector lineup.

Edgeboard Connectors Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify mechanical footprint and electrical characteristics carefully if considering alternative sources.