10151347-110MLF

Edgeboard Connectors Overview

The 10151347-110MLF is a surface-mount header connector manufactured by Amphenol ICC (FCI). It features 10 positions with a 1.27mm pitch, designed for reliable signal transmission in compact electronic assemblies. The component utilizes gold-plated contacts to ensure low contact resistance and corrosion resistance, while the tin-plated tail facilitates secure soldering to printed circuit boards. This straight-style connector supports high-density mounting requirements.

Edgeboard Connectors Feature Summary

• Gold-plated mating contacts provide durable electrical performance
• Tin-plated tails enable robust surface-mount soldering
• Straight header configuration optimizes board space utilization

Edgeboard Connectors Applications

• High-density server backplanes
• Storage subsystem interconnects
• Telecommunications equipment modules

Edgeboard Connectors Procurement Notes

Verify the specific suffix 'MLF' against official Amphenol documentation to confirm plating specifications and material composition. Ensure compatibility with existing PCB footprint designs before procurement. Confirm RoHS compliance status through current manufacturer certificates as product revisions may occur.

Edgeboard Connectors Selection Notes

Select this component when a 10-position, 1.27mm pitch surface-mount header is required. Evaluate mechanical retention needs and mating force characteristics against system constraints. Verify that the straight orientation aligns with spatial restrictions within the target enclosure design.

Edgeboard Connectors Part Context

This part belongs to the Rib-Cage III series of connectors from Amphenol ICC (FCI), known for high reliability in demanding environments. The series supports various pin counts and configurations tailored for data center and communication infrastructure applications requiring stable signal integrity.

Edgeboard Connectors Replacement Considerations

Consult official cross-reference guides for direct substitutes. Generic equivalents may differ in contact geometry or retention mechanisms. Validate dimensional tolerances and mating interface compatibility before considering alternative sources.