10AS027H3F35I2SG

Overview

The Altera 10AS027H3F35I2SG is an Arria 10 SX SoC FPGA featuring a dual-core ARM Cortex-A9 processor and 270,000 logic elements. It operates within a voltage range of 870 mV to 980 mV at a maximum frequency of 1.5 GHz. The device includes 14.65 Mbit of embedded memory and supports up to 384 I/Os with 24 transceivers capable of 17.4 Gb/s data rates. Designed for industrial environments, it functions between -40°C and +100°C in an FBGA-1152 package.

Feature Summary

• Integrates a dual-core ARM Cortex-A9 processor with the programmable fabric for hardware-software co-design
• Supports high-speed serial communications via multiple full-duplex transceivers
• Provides enhanced security features including secure boot and anti-tamper mechanisms

Applications

• Industrial automation systems requiring real-time control and processing
• Automotive infotainment and instrument cluster designs
• Communications infrastructure equipment

Procurement Notes

Verify component authenticity through authorized channels due to export restrictions. Confirm RoHS compliance status and check for specific shipping documentation requirements mandated by US export regulations before finalizing acquisition. Ensure handling guidelines are followed to maintain moisture sensitivity integrity.

Selection Notes

Select this model when a balance of moderate logic capacity and integrated processing is required. Compare against the 10AS027H2 variant for speed grade differences. Consider the 10AS032 series if higher logic density or memory resources are necessary for complex signal processing tasks.

Part Context

This component belongs to the Arria 10 SX family, targeting cost-sensitive applications requiring significant processing power alongside programmable logic. It utilizes 20nm technology to deliver performance per watt advantages over previous generations while maintaining compatibility with existing Intel FPGA design tools.

Replacement Considerations

Direct substitutes include other Arria 10 SX devices with equivalent pin counts and logic densities. Verify thermal characteristics and pin-to-pin compatibility when considering alternative speed grades within the same package family.