SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Altera 10AX022E3F29E2SG is an Arria 10 GX FPGA featuring a 484-pin FC-BGA package. It contains 22,000 Adaptive Logic Modules (ALMs) and supports up to 17.4 Gbps data rates via its transceivers. The device integrates dual ARM Cortex-A9 processors operating at frequencies up to 1.2 GHz. Embedded memory totals approximately 6.5 Mbit, distributed across embedded blocks and hard IP. Power supply voltages range from 0.85V to 1.25V depending on the specific I/O standard and core requirements.
Verify export compliance status as this component may require additional documentation for international shipping. Confirm the specific ordering suffix matches the required temperature grade and package variant. Ensure the source document explicitly identifies the manufacturer as Intel or Altera to avoid counterfeit risks. Check for any product change notifications that might affect pinout or electrical characteristics prior to final procurement authorization.
Select this model when the design requires a balance between moderate logic density and significant embedded processing power. The Arria 10 GX series is suitable for applications needing multiple high-speed serial links without the cost of larger Stratix devices. Evaluate the available ALM count against logic complexity and ensure the embedded memory suffices for buffer requirements before choosing alternative family members.
This part belongs to the Arria 10 GX family, designed for mid-range performance applications. It shares architectural similarities with other Arria 10 variants but offers distinct resource scaling. The E3 suffix typically denotes a specific speed grade within the GX lineup, influencing timing closure capabilities for high-frequency designs compared to lower-grade counterparts in the same package.
Direct replacements include other Arria 10 GX parts with identical pin counts such as 10AX022C3F29E2SG if speed grades differ. Cross-family migration to Cyclone V or Stratix 10 requires significant redesign due to architectural differences. Verify pin compatibility and thermal solutions when substituting with higher-density variants in the same package footprint.