10AX027H3F34I2SG

10AX027H3F34I2SG

$1,619.27
  • Description:IC FPGA 384 I/O 1152FBGA
  • Series:Arria 10 GX

SKU:da9a75f9af9a Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 384 I/O 1152FBGA
  • Series:Arria 10 GX
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:101620
  • Number of Logic Elements/Cells:270000
  • Total RAM Bits:17870848
  • Number of I/O:384
  • Voltage - Supply:0.87V ~ 0.93V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1152-BBGA, FCBGA
  • Supplier Device Package:1152-FBGA, FC (35x35)
  • Grade:-
  • Qualification:-

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10AX027H3F34I2SG

Overview

The Altera 10AX027H3F34I2SG is an Arria 10 GX 270 Field Programmable Gate Array (FPGA) manufactured by Intel. It features 270,000 logic elements and 101,620 Adaptive Logic Modules within its programmable fabric. The device integrates 14.65 Mbit of embedded memory and supports up to 384 I/O pins. It includes 24 high-speed transceivers capable of data rates up to 17.4 Gb/s for chip-to-chip communications. The core operating voltage ranges from 870 mV to 980 mV, with a typical value of 950 mV. The component operates within a temperature range of -40°C to +100°C and is housed in an FBGA-1152 package.

Feature Summary

  • Integrates a high-density programmable logic fabric with significant embedded memory resources for complex digital signal processing and system integration tasks.
  • Equipped with multiple high-speed serial transceivers supporting advanced communication protocols and high-bandwidth data transfer requirements.
  • Designed for robust operation across extended industrial temperature ranges with flexible power supply configurations.

Applications

  • High-performance networking equipment requiring multi-gigabit interface capabilities
  • Industrial automation systems demanding reliable programmable logic control
  • Test and measurement instruments utilizing high-speed data acquisition

Procurement Notes

Verify the specific ordering suffix against official Intel documentation to confirm package type, temperature grade, and lead time classifications. Ensure compliance with export control regulations as this product may require additional documentation for international shipping. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly.

Selection Notes

Select this model when the design requires approximately 270K logic elements combined with substantial embedded memory and high-speed serial connectivity. Compare against the 10AS series if an integrated ARM Cortex-A9 processor subsystem is required instead of pure FPGA fabric. Evaluate pin count and thermal dissipation requirements associated with the FBGA-1152 package for the target application environment.

Part Context

This component belongs to the Arria 10 GX family, which targets bandwidth-intensive applications. It shares architectural similarities with other 270-series devices like the 10AX027H4F35I3SG but differs in speed grading and package options. The GX designation indicates optimization for general-purpose high-speed interconnects rather than the SoC variants containing hardened processors.

Replacement Considerations

Direct replacements include other Arria 10 GX 270 variants such as 10AX027H3F35I2LG or 10AX027H4F35I3SG, depending on specific speed grades and package availability. Verify pin compatibility and electrical specifications before substituting.

10AX027H3F34I2SG10AX027H3F34I2SG
$1,619.27
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