SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Knowles Syfer 1206J2000153MXTE07 is a three-terminal multilayer ceramic capacitor (MLCC) designed for surface mount technology. It features a 1206 package size with a capacitance of 15 nF and a voltage rating of 200 VDC. The component utilizes X7R dielectric material, providing a tolerance of ±20%. It incorporates a nickel barrier electrode structure with 100% tin terminations to enhance solderability and reliability. This specific configuration functions as an EMI filter, offering superior noise suppression capabilities compared to standard two-terminal devices within the same footprint.
Verify the complete part number including suffixes to ensure correct termination and dielectric specifications. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Check for any regional distribution restrictions or availability limitations directly with authorized suppliers before finalizing procurement plans.
Select this component when three-terminal EMI filtering is required in a compact 1206 footprint. The X7R dielectric suits general-purpose applications requiring moderate temperature stability. Ensure circuit voltage does not exceed the 200 VDC rating. Consider the physical dimensions and terminal layout compatibility with the target PCB design during the selection process.
This component belongs to the Knowles Syfer MLCC series, specifically engineered for surface mount applications. The 1206J prefix indicates the case size and voltage class within the manufacturer's catalog. The MXTE07 suffix denotes specific termination and packaging details. These capacitors are part of a broader family of high-reliability ceramic components used in demanding electronic environments.
Direct substitutes must match the 1206J2000153MXTE07 part number exactly to maintain electrical and mechanical compatibility. Verify that alternative three-terminal EMI filters offer equivalent capacitance, voltage rating, and dielectric type. Cross-reference pin configurations and terminal materials to ensure seamless integration without redesigning the printed circuit board.