1512141174

Edgeboard Connectors Overview

The Molex 1512141174 is an Edgeline 25 vertical connector designed for high-speed data transmission. It features a 0.80mm pitch and supports 25 Gbps signal rates. The component accommodates 174 circuits across two bays, suitable for PCB thicknesses of 1.57mm. This connector ensures stable operation and integrates effectively with existing software tools for embedded communication applications.

Edgeboard Connectors Feature Summary

• Supports high-speed data transmission at 25 Gbps
• Designed for vertical mounting configurations
• Accommodates 174 circuits in a dual-bay layout

Edgeboard Connectors Applications

• Embedded communication systems
• High-density server backplanes
• Data center interconnects

Edgeboard Connectors Procurement Notes

Verify the specific pin configuration and mating partner compatibility before ordering. Confirm that the target PCB stack-up matches the 1.57mm thickness requirement. Ensure the design supports the 0.80mm pitch constraints to maintain signal integrity at 25 Gbps speeds.

Edgeboard Connectors Selection Notes

Select this connector when high bandwidth and vertical form factors are required. The 174-circuit capacity suits complex I/O needs. Consider the 25 Gbps performance limit for future-proofing high-speed links. Evaluate space constraints due to the dense 0.80mm pitch arrangement.

Edgeboard Connectors Part Context

This part belongs to the Molex Edgeline 25 family, which specializes in high-performance interconnect solutions. The series targets demanding applications requiring significant data throughput within compact footprints. It complements other components in the ecosystem by providing reliable vertical connectivity options.

Edgeboard Connectors Replacement Considerations

No direct public substitute part numbers are confirmed for this specific model. Verify if alternative pitches or circuit counts from the same family meet the design requirements.