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The 16CTQ080S is a dual Schottky rectifier diode array manufactured by SMC Diode Solutions. It features a common cathode configuration housed in a surface-mount D2PAK (TO-263AB) package. The device supports a maximum repetitive peak reverse voltage of 80V and an average forward rectified current of 8A per diode. Key electrical characteristics include a low forward voltage drop and a maximum DC reverse leakage current of 5mA at the rated voltage. The component is designed for high-temperature operation with a junction temperature range extending up to 175°C, ensuring reliability in demanding power electronics applications.
Verify the specific suffix 'S' corresponds to the D2PAK surface-mount package variant rather than through-hole options. Confirm that the 175°C junction temperature rating aligns with the thermal management design of the target application. Ensure compatibility with standard reflow soldering profiles for TO-263 packages during assembly processes.
Select this component when a compact dual-diode solution is required for low-voltage, high-current applications. The 80V rating suits systems operating within this voltage ceiling. Consider the D2PAK footprint for PCB space constraints. Evaluate thermal dissipation requirements given the 175°C rating to ensure adequate heat sinking or board copper area allocation for optimal performance.
This part belongs to the 16CTQ series of dual Schottky rectifiers from SMC Diode Solutions. The series offers various voltage ratings and packaging options to suit different power management needs. The 16CTQ080S specifically targets applications requiring robust reverse blocking capabilities and efficient rectification in a surface-mount form factor, distinguishing it from single-diode or through-hole variants in the manufacturer's portfolio.
Direct substitutes must match the 80V reverse voltage, 8A current rating, and D2PAK package. Verify pinout compatibility for common cathode configurations. Check if alternative manufacturers offer equivalent 175°C thermal ratings and similar forward voltage characteristics to ensure seamless integration without redesigning the thermal or electrical circuit.