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171-170-231-012 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN MICROTCA FMALE 170POS 0.030. Review the specifications below when checking this part for your BOM.
The EDAC Inc. part number 171-170-231-012 is a Micro TCA connector belonging to the 171 Series. It is specified as a female connector with 170 positions. The component utilizes a 0.75 mm pitch and features a housing constructed from Liquid Crystal Polymer (LCP). The contact material is identified as Copper Alloy. This configuration supports high-density interconnect requirements within telecommunications infrastructure applications.
Verify the specific revision level and packaging quantity against the manufacturer's current documentation before ordering. Confirm that the LCP housing material and copper alloy contacts meet the environmental and mechanical stress requirements of the target assembly. Ensure compatibility with mating male connectors in the same series to maintain proper alignment and electrical continuity.
Select this component when a 170-position female interface is required for Micro TCA architectures. The 0.75 mm pitch dictates board layout constraints and mating partner selection. Evaluate the LCP housing properties for thermal resistance needs. Confirm that the copper alloy contact specification aligns with the current carrying and durability demands of the application environment.
This connector belongs to the EDAC 171 Series, which focuses on Micro TCA standards. The series provides standardized interfaces for high-density telecommunications equipment. The 171-170-231-012 variant specifically addresses the need for robust female connections in dense packing configurations common in modern network hardware.
Consult official EDAC substitution guides for compatible alternatives. Verify pin count, pitch, and housing material compatibility before considering cross-references. Generic D-sub or standard pitch connectors are not suitable replacements due to differing form factors and electrical specifications.
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