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1717741118 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Molex. Its product description is CONN EDGE DUAL FML 118POS 0.031. Review the specifications below when checking this part for your BOM.
The Molex 1717741118 is an EdgeLine 25 vertical connector designed for high-speed data transmission. It features a 0.80mm pitch and supports speeds up to 25 Gbps. The component includes 118 circuits arranged in 2 bays with 20 differential pairs. It is engineered for a PCB thickness of 1.57mm and utilizes gold plating on the contact surfaces.
Verify that the specific order matches the official Molex part number 1717741118. Confirm compatibility with the required 1.57mm PCB thickness and 25 Gbps performance requirements before purchase. Ensure sourcing from authorized distributors to guarantee product authenticity and traceability.
Select this connector when high-density, high-speed vertical interconnection is required. The 0.80mm pitch allows for significant circuit density within limited board space. Verify that the application environment supports the specified 25 Gbps data rate and that the mechanical fit aligns with the 1.57mm PCB constraint.
This component belongs to the Molex EdgeLine series, which specializes in high-speed connectivity solutions. The series is characterized by its ability to maintain signal integrity at multi-gigabit speeds while minimizing footprint. This specific model represents a vertical configuration suitable for board-to-board or backplane applications requiring robust electrical performance.
No public confirmed substitute part numbers are available.
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