1806J0500104MJTE07

Overview

The Knowles Syfer 1806J0500104MJTE07 is a multilayer ceramic capacitor (MLCC) designed for surface mount technology. It features a 1806 case size with a capacitance of 100 nF and a DC voltage rating of 50 VDC. The component utilizes X7R dielectric material, providing a tolerance of ±20%. It is manufactured by Knowles under the Syfer brand and complies with RoHS standards.

Feature Summary

• Utilizes X7R dielectric material for stable performance across temperature variations
• Designed for surface mount assembly on printed circuit boards
• Complies with RoHS environmental directives

Applications

• General purpose electronic circuits requiring SMD capacitors
• Power supply filtering applications
• Signal coupling and decoupling in consumer electronics

Procurement Notes

Verify the specific suffix TE07 against official datasheets to confirm packaging type and terminal configuration. Ensure the X7R dielectric and 50V rating align with circuit requirements. Cross-reference the manufacturer part number with authorized distributor listings to confirm authenticity and current production status before procurement.

Selection Notes

Select this component when a 1806 footprint is required for 100 nF capacitance at 50 VDC. The X7R dielectric offers higher volumetric efficiency than C0G but lower stability. Verify that the ±20% tolerance meets the design specifications. Consider thermal derating curves if operating near maximum temperature limits.

Part Context

This component belongs to the Knowles Syfer MLCC family, which specializes in high-reliability ceramic capacitors. The 1806J series indicates a standard 1806 metric package with J-series coding. These parts are widely used in industrial and commercial electronics where space constraints and reliability are critical factors.

Replacement Considerations

Check for direct substitutes within the same 1806 package and electrical ratings from other manufacturers. Ensure equivalent dielectric characteristics and tolerance levels. Verify compatibility with existing PCB footprints and reflow soldering profiles.