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1N4500
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Product Detailed Parameters
- Description：DIODE STANDARD DO204AH
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：-
- Current - Average Rectified (Io)：-
- Voltage - Forward (Vf) (Max) @ If：1.1 V @ 300 mA
- Speed：Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr)：6 ns
- Current - Reverse Leakage @ Vr：-
- Capacitance @ Vr, F：-
- Mounting Type：Through Hole
- Package / Case：DO-204AH, DO-35, Axial
- Supplier Device Package：DO-204AH (DO-35)
- Operating Temperature - Junction：-65°C ~ 175°C
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Overview
The Microchip Technology 1N4500 is a hermetically sealed, metallurgically bonded switching diode qualified per MIL-PRF-19500/403. It features double plug construction in a DO-35 glass package with copper-clad steel leads and tin/lead finish. Maximum ratings include an operating temperature range of -65°C to +175°C, a forward current of 250 mA at 25°C, and a breakdown voltage of 75 V DC. Electrical characteristics specify a maximum reverse leakage current of 100 nA at 75 V and a capacitance of 4.0 pF at 0 V.
Feature Summary
- Hermetically sealed glass package constructed using metallurgical bonding techniques
- Double plug design ensuring structural integrity for demanding environments
- Qualified to MIL-PRF-19500/403 standards for high reliability applications
Applications
- Military electronic systems requiring radiation and environmental resistance
- High-reliability computer diode circuits
- Signal processing applications utilizing fast recovery characteristics
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official documentation to confirm exact lead finish and qualification levels. The base part number denotes the core device; suffixes may indicate variations in packaging or testing criteria. Ensure procurement channels provide traceable documentation confirming compliance with MIL-PRF-19500/403 requirements for your intended deployment.
Selection Notes
Select this component when hermetic sealing and military qualification are mandatory. The DO-35 outline provides a standard footprint for through-hole mounting. Consider the thermal derating requirement of 2.0 mAdc/°C for ambient temperatures above 25°C. Verify that the copper-clad steel lead material meets the mechanical stress requirements of the assembly process.
Part Context
This device belongs to the family of general-purpose switching diodes designed for harsh environments. Unlike commercial equivalents, it utilizes a glass passivation layer and metallurgical bond to prevent moisture ingress. The DO-35 case style is widely recognized in legacy aerospace and defense schematics for its proven long-term stability under extreme thermal cycling.
Replacement Considerations
Direct replacements must match the MIL-PRF-19500/403 qualification level. Verify pinout compatibility and ensure substitute devices offer equal or superior surge current handling capabilities. Cross-reference datasheets to confirm identical package dimensions and lead specifications for seamless integration.
