1N5420US/TR

$8.37

Description：DIODE STANDARD 600V 3A D5B
Series：-
Mfr：Microchip Technology
Package：Tape & Reel (TR)

SKU:d2ae5cad95e6 Category: Single Diodes Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：DIODE STANDARD 600V 3A D5B
Series：-
Mfr：Microchip Technology
Package：Tape & Reel (TR)
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：600 V
Current - Average Rectified (Io)：3A
Voltage - Forward (Vf) (Max) @ If：1.5 V @ 9 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：400 ns
Current - Reverse Leakage @ Vr：1 µA @ 600 V
Capacitance @ Vr, F：-
Mounting Type：Surface Mount
Package / Case：SQ-MELF, E
Supplier Device Package：D-5B
Operating Temperature - Junction：-65°C ~ 175°C

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1N5420US/TR

Overview

The 1N5420US/TR is a fast recovery rectifier manufactured by Microchip Technology. It features a single configuration with a maximum repetitive peak reverse voltage of 600 V and an average forward rectified current of 3 A. The device utilizes a B-SQ-MELF-2 surface-mount package and exhibits a forward voltage drop of 1.5 V at rated current. Its maximum reverse leakage current is specified at 1 uA, with a typical reverse recovery time of 400 ns. The component supports a maximum surge current of 80 A and operates within a temperature range from -65 C to +175 C.

Feature Summary

Fast recovery rectification capability for efficient switching applications
High thermal stability supporting extended operating temperatures up to 175 C
Robust surge current handling capacity for transient protection

Applications

General-purpose rectification in power supply circuits
Free-wheeling diodes in inductive load switching
DC-DC converter output stages

Procurement Notes

Verify the specific suffix and manufacturer documentation to confirm exact electrical tolerances and package dimensions before integration. Ensure compatibility with automated surface-mount assembly processes given the MELF form factor. Cross-reference official datasheets for any recent product change notifications or material compliance updates relevant to your manufacturing region.

Selection Notes

Select this component when high-speed recovery characteristics are required alongside standard rectification duties. The surface-mount MELF package facilitates compact board layouts compared to through-hole alternatives. Evaluate the thermal management requirements carefully due to the high junction temperature rating and potential heat dissipation needs under continuous load conditions.

Part Context

This part belongs to Microchip's discrete diode portfolio, specifically designed for robust power conversion tasks. The US/TR designation indicates a tape-and-reel packaging format suitable for high-volume automated assembly lines. It represents a transition from traditional axial leads to modern surface-mount technologies while maintaining established performance benchmarks.