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The Microchip Technology 1N5550US is a surface mount equivalent of the JEDEC registered 1N5550 series. It features a voidless hermetically sealed glass package with extremely robust construction. Key electrical parameters include a reverse voltage of 200 V, forward current of 3 A, and forward voltage of 1.2 V. The device supports a maximum surge current of 100 A and has a reverse recovery time of 2 µs. Reverse leakage current is specified at 1 µA.
Verify the specific suffix (e.g., -TR) to confirm tape and reel packaging requirements. Confirm that the hermetically sealed glass package meets your environmental specifications. Ensure the surface mount footprint matches your PCB design constraints before ordering.
Select this component when a surface mount solution is required for standard recovery rectification. It serves as a direct physical replacement for the axial leaded 1N5550 while maintaining similar electrical characteristics. Consider the hermetic seal for reliability in harsh environments.
This part belongs to the 1N5550US family, which are surface mount versions of the classic 1N5550 through 1N5554 diodes. Manufactured by Microchip Technology, these devices utilize a D-5B case outline. They are designed to offer the performance of the legacy series in a modern surface mount format.
Direct surface mount replacements include the 1N5551US, 1N5552US, 1N5553US, and 1N5554US for higher voltage ratings. For through-hole equivalents, the original 1N5550 series remains compatible electrically but differs physically.