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The Microchip Technology 1N5804 is a single fast recovery rectifier diode designed for through-hole mounting. It features a maximum repetitive peak reverse voltage of 100 V and an average forward current rating of 2.5 A. The device exhibits a typical forward voltage drop of 875 mV at rated current and a maximum reverse leakage current of 1 uA. Its ultra-fast switching capability is characterized by a reverse recovery time of 25 ns, with a maximum surge current capacity of 35 A. The component operates within a junction temperature range of -65°C to +175°C and is supplied in bulk packaging.
Verify the package type against project requirements, as distributor listings may indicate surface mount variants while official datasheets specify through-hole configurations. Confirm RoHS compliance status directly with the manufacturer, as regulatory markings can vary by production batch. Ensure the ordering suffix matches the required lead time and packaging format. Cross-reference the specific revision level of the datasheet to confirm electrical parameters align with design constraints before finalizing procurement.
Select this component when a fast recovery rectifier with a 100 V rating and 2.5 A continuous current capacity is required. The low reverse leakage current makes it suitable for sensitive circuitry. Consider the thermal management capabilities given the wide operating temperature range. Evaluate the package style compatibility with the printed circuit board layout, ensuring the chosen variant matches the assembly method specified in the design documentation.
The 1N5804 belongs to the family of fast recovery rectifiers manufactured by Microchip Technology. This series is engineered for applications requiring rapid switching speeds and reliable performance under varying thermal conditions. The component serves as a critical element in power conversion stages where minimizing reverse recovery charge is essential for efficiency and signal integrity in electronic systems.
Consult official substitution guides for compatible alternatives. Verify that any substitute part maintains equivalent voltage, current, and recovery time specifications. Ensure package compatibility if physical footprint constraints exist. Review manufacturer cross-reference lists for validated replacements that meet the same military or industrial standards.