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The GeneSiC Semiconductor 1N5832R is a silicon power Schottky diode housed in a DO-5 (DO-203AB) stud-mount package. It features a repetitive peak reverse voltage of 20 V and an average forward current rating of 40 A. The device exhibits a maximum instantaneous forward voltage of 0.70 V at 40 A and 25 °C, with a thermal resistance junction-to-case of 1.45 °C/W. It supports a peak forward surge current of 800 A and operates within a junction temperature range of -55 °C to 150 °C. The 'R' suffix indicates reversed polarity where the stud functions as the anode.
Verify the specific ordering suffix against the manufacturer's documentation to confirm terminal configuration. The 'R' designation denotes reversed polarity where the stud serves as the anode rather than the cathode. Confirm that the required mounting torque aligns with the specified mechanical limits for the DO-5 package to ensure reliable electrical contact and thermal performance during installation.
Select this component when a low forward voltage drop is critical for efficiency in high-current applications. The stud-mount package facilitates direct heat sinking to chassis or cold plates. Ensure the operating environment stays within the specified thermal limits and that the circuit design accommodates the 20 V reverse voltage rating. Verify compatibility with the reversed polarity configuration if the stud must serve as the positive terminal.
This device belongs to the 1N5832 through 1N5834R series of silicon power Schottky rectifiers. These components are designed for general-purpose rectification in low voltage, high frequency environments. The series utilizes planar technology to provide superior performance and reliability compared to standard junction devices, making them suitable for demanding power conversion tasks.
Cross-reference with other manufacturers offering DO-5 packaged Schottky diodes with equivalent 20 V and 40 A ratings. Verify that any substitute maintains the same stud polarity configuration and thermal resistance characteristics to ensure seamless integration without redesigning the cooling system.