SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Microchip Technology 1N6073US is a surface mount ultrafast recovery glass power rectifier designed for high-reliability applications. It features a voidless hermetically sealed package with an internal Category I metallurgical bond. The device has a working peak reverse voltage of 50 V and an average rectified forward current of 3.0 A at TEC = +70°C. Key electrical characteristics include a maximum reverse recovery time of 30 ns, a maximum reverse leakage current of 1.0 µA at VRWM, and a junction temperature range of -65°C to +155°C.
Verify the specific revision level and manufacturing origin when sourcing this component. Confirm that the termination finish matches the required specification, as previous inventory utilized solid silver end caps with tin/lead finish rather than the standard copper with tin/lead. Ensure compliance with any applicable military screening requirements if JAN, JANTX, JANTXV, or JANS levels are needed.
Select the 1N6073US for circuits requiring a 50 V reverse voltage rating and 3 A continuous current capability in a surface mount format. This package size is suitable where thermal resistance of 13°C/W is acceptable. Consider higher current variants like the 1N6076US or 1N6079US if the application demands greater surge current handling or lower thermal impedance.
This component belongs to the 1N6073US through 1N6081US series of ultrafast recovery rectifiers. The series offers various current ratings from 3 A to 12 A and voltage ratings from 50 V to 150 V across different package sizes (Package A, E, and G). All devices share the same voidless hermetic glass construction technology.
Axial-leaded equivalents are available by removing the US suffix, specifically the 1N6073 part number. For military qualification levels, prefixes such as MQ, MX, MV, or SP can be used with the base number.