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The 1N6620/TR is a single fast recovery rectifier manufactured by Microchip Technology. It features a maximum repetitive peak reverse voltage of 200 V and an average forward rectified current of 2 A. The device exhibits a forward voltage drop of 1.6 V at rated current and a maximum reverse leakage current of 500 nA. Its fast recovery time is specified at 45 ns, with a maximum surge current capability of 20 A. The component operates within a junction temperature range of -65°C to +150°C and utilizes the A-Package-2 form factor.
Verify the specific suffix configuration against official Microchip documentation to confirm package type and environmental compliance status. Ensure that the ordering information matches the required mounting style and lead-free specifications. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status before finalizing procurement decisions.
Select this component when a 200 V blocking voltage and 2 A continuous current rating are required for fast recovery applications. Consider the 45 ns reverse recovery time for efficiency in switching circuits. Evaluate the A-Package-2 footprint compatibility with existing PCB layouts. Compare against similar variants like the 1N6620U/TR if ultra-fast recovery or different mounting styles are necessary for the specific design constraints.
This rectifier belongs to the 1N6620 series of fast recovery diodes produced by Microchip Technology. The series includes various packages and voltage ratings tailored for different power management needs. The 1N6620 variant specifically targets applications requiring moderate voltage isolation with rapid switching capabilities, distinguishing it from standard recovery diodes in the same product family.
The JANTX1N6620US/TR serves as a verified substitute offering identical electrical parameters including 200 V reverse voltage and 2 A forward current. Both components share the same 45 ns recovery time and 1.6 V forward voltage drop. Verify pinout compatibility and package dimensions before implementing any substitution in existing designs.