1N8033-GA

1N8033-GA

$140.25
  • Description:DIODE SIL CARB 650V 4.3A TO276
  • Series:-
  • Mfr:GeneSiC Semiconductor
  • Package:Tube

SKU:cd830c10fe46 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE SIL CARB 650V 4.3A TO276
  • Series:-
  • Mfr:GeneSiC Semiconductor
  • Package:Tube
  • Technology:SiC (Silicon Carbide) Schottky
  • Voltage - DC Reverse (Vr) (Max):650 V
  • Current - Average Rectified (Io):4.3A
  • Voltage - Forward (Vf) (Max) @ If:1.65 V @ 5 A
  • Speed:No Recovery Time > 500mA (Io)
  • Reverse Recovery Time (trr):0 ns
  • Current - Reverse Leakage @ Vr:5 µA @ 650 V
  • Capacitance @ Vr, F:274pF @ 1V, 1MHz
  • Mounting Type:Surface Mount
  • Package / Case:TO-276AA
  • Supplier Device Package:TO-276
  • Operating Temperature - Junction:-55°C ~ 250°C
  • Grade:-
  • Qualification:-

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1N8033-GA

Overview

The GeneSiC Semiconductor 1N8033-GA is a Silicon Carbide (SiC) Schottky rectifier designed for high-voltage applications. It features a 650 V reverse voltage rating and supports an average forward current of 5 A. The device utilizes a DO-4 stud mount package, facilitating efficient thermal management in power electronics. Key electrical characteristics include a low forward voltage drop and minimal reverse leakage current, ensuring high efficiency. The component operates within a temperature range of -55°C to +150°C, providing robust performance in demanding environments.

Feature Summary

  • Utilizes Silicon Carbide technology for superior high-temperature operation and reduced switching losses compared to silicon alternatives.
  • Features a stud mount configuration that enables direct attachment to heatsinks for effective thermal dissipation.
  • Designed with a low forward voltage characteristic to minimize conduction losses during high-current operation.

Applications

  • High-frequency DC/DC converters
  • Power factor correction circuits
  • Uninterruptible power supplies

Procurement Notes

Verify the specific ordering suffix against official GeneSiC documentation to ensure correct packaging and terminal plating specifications. Confirm that the required thermal interface materials are compatible with the stud mount package style. Ensure that the procurement source provides valid traceability documents. Check for any specific handling requirements related to the ceramic or metal construction of the DO-4 package before placing orders.

Selection Notes

Select this component when designing systems requiring high breakdown voltage and fast switching speeds. The SiC material choice is critical for reducing thermal resistance and improving overall system efficiency. Consider the stud mount package for applications where direct chassis mounting is necessary for heat removal. Evaluate the forward voltage drop at the expected operating current to ensure it meets the efficiency targets of the power stage design.

Part Context

This part belongs to the GeneSiC Semiconductor portfolio of wide-bandgap power devices. It is engineered to replace traditional silicon rectifiers in high-performance applications. The series focuses on maximizing power density and reliability. The manufacturer specializes in silicon carbide solutions for industrial and automotive markets.

Replacement Considerations

Consult official cross-reference lists from GeneSiC Semiconductor for verified equivalent parts. Ensure that any substitute maintains the same 650 V rating and 5 A current capacity. Verify that the replacement package matches the DO-4 stud mount dimensions for mechanical compatibility.

1N8033-GA1N8033-GA
$140.25
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