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1SG280HU1F50I2VGAS is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA 704 I/O 2397BGA. Review the specifications below when checking this part for your BOM.
The Altera 1SG280HU1F50I2VGAS is a Stratix 10 GX FPGA featuring 2,800,000 logic elements and 933,120 Adaptive Logic Modules. It integrates 229 Mbit of embedded memory and supports up to 1,160 I/Os. The device operates within a supply voltage range of 770 mV to 970 mV, with a typical operating voltage of 940 mV. It includes 96 transceivers capable of data rates up to 28.3 Gb/s. The component is housed in a 2397-FBGA package (FCBGA) measuring 50x50 mm and functions at junction temperatures between 0°C and 100°C.
Verify the specific suffix 'E1' against official Intel/Altera documentation to confirm electrical grade and revision status. Ensure compatibility with Quartus Prime Pro software versions supporting Stratix 10 devices. Confirm moisture sensitivity level handling requirements during assembly. Validate that the 2397-BBGA package footprint matches the target PCB design guidelines.
Select this model for applications requiring high logic density combined with significant embedded memory resources. The 96-transceiver configuration suits designs needing extensive serial connectivity. Compare against the 1SG280HU2 variant if higher I/O counts or different speed grades are required. Ensure thermal management solutions accommodate the power consumption profiles defined in the datasheet.
This part belongs to the Intel Stratix 10 GX family, designed for high-performance computing and communications markets. It utilizes Intel's 16-nanometer FinFET technology to deliver high bandwidth and power efficiency. The Stratix 10 series integrates hard processor systems and advanced IP cores to accelerate complex system-on-chip implementations.
Publicly confirmed direct substitute part numbers are not available in the provided source material. Evaluate other Stratix 10 GX variants with similar logic densities and package configurations for potential pin-compatible alternatives.
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