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1ST165EU1F50I2LG is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA 440 I/O 2397BGA. Review the specifications below when checking this part for your BOM.
The Altera 1ST165EU1F50I2LG is a Stratix 10 TX Field Programmable Gate Array (FPGA) IC. It features 1,650,000 logic elements and 440 I/Os housed in a 2397-ball FCBGA package. The device operates with a supply voltage range of 0.82V to 0.88V and supports a junction temperature range of -40°C to 100°C. This component belongs to the Stratix 10 TX series, designed for high-performance programmable logic applications requiring significant computational density within a surface-mount form factor.
Verify the specific ordering suffix 'LG' against official Intel/Altera documentation to confirm package marking and material compliance details. Ensure compatibility with required power delivery networks supporting the specified voltage range. Confirm availability through authorized distributors as lead times may vary based on manufacturing schedules.
Select this part when a Stratix 10 TX device with approximately 1.65M LEs and 440 I/Os is required. The 'I2' suffix indicates industrial temperature grade (-40°C to 100°C TJ). The 'LG' suffix denotes specific packaging or labeling variations; verify against current datasheets for exact mechanical and electrical specifications before finalizing the design.
This component is part of the Intel (formerly Altera) Stratix 10 family, specifically the TX variant optimized for transceiver performance. It sits alongside other variants like the 1ST165EU2F50I2LGAS, differing primarily in suffix codes that define package markings, environmental certifications, or minor manufacturing revisions rather than core logical functionality.
Direct replacements include other 1ST165EU1F50I2LG variants with different suffixes if package marking differences are acceptable. Cross-family migration to Agilex devices requires architectural redesign. Verify pin-to-pin compatibility with existing PCB layouts when considering alternative packages within the same logic density class.
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