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Product Detailed Parameters
- Description：RF DIODE PIN 50V 150MW 3CP
- Series：-
- Mfr：onsemi
- Package：Bulk
- Diode Type：PIN - Single
- Voltage - Peak Reverse (Max)：50V
- Current - Max：50 mA
- Capacitance @ Vr, F：0.23pF @ 50V, 1MHz
- Resistance @ If, F：4.5Ohm @ 10mA, 100MHz
- Power Dissipation (Max)：150 mW
- Operating Temperature：125°C (TJ)
- Package / Case：TO-236-3, SC-59, SOT-23-3
- Supplier Device Package：3-CP
- Grade：-
- Qualification：-
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Overview
The 1SV250-TB-E is a silicon epitaxial PIN diode designed for VHF, UHF, and AGC applications. It features a small-sized package that facilitates high-density mounting. Key electrical parameters include a maximum reverse voltage of 50V and a maximum forward current of 50mA. The device exhibits a typical interterminal capacitance of 0.23pF at 5V reverse bias and 1MHz frequency. Maximum forward series resistance is specified at 4.5Ω under 10mA forward current conditions.
Feature Summary
- Small-sized package facilitates high-density mounting
- Small interterminal capacitance (C=0.23pF typ)
- Small forward series resistance (rs=4.5Ω max)
Applications
- VHF applications
- UHF applications
- AGC applications
Procurement Notes
Verify the manufacturer origin carefully. The datasheet identifies SANYO Electric Co., Ltd. as the original manufacturer. Confirm whether the specific 'TB-E' suffix corresponds to the standard CP package dimensions and marking ('FV') documented in the official specifications. Ensure compliance with the stated restrictions regarding life-support or aerospace usage.
Selection Notes
Select this component when low interterminal capacitance is critical for VHF/UHF signal integrity. The 50V reverse voltage rating suits moderate voltage switching environments. Verify that the 4.5Ω maximum forward series resistance meets the insertion loss requirements of the target circuit design.
Part Context
This part belongs to the 1SV250 series of silicon epitaxial PIN diodes. It is manufactured using a process optimized for RF switching performance. The device utilizes a CP package format, which is a compact surface-mount configuration suitable for space-constrained PCB layouts.
Replacement Considerations
Check for direct equivalents from other manufacturers offering similar CP packages and 0.23pF capacitance characteristics. Verify pinout compatibility (Anode-NC-Cathode) before substitution.
