1SX085HN3F43E3XG

1SX085HN3F43E3XG

$6,909.70
  • Description:IC FPGA STRATIX 10 1760FBGA
  • Series:Stratix® 10 SX

SKU:804b5f396d52 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA STRATIX 10 1760FBGA
  • Series:Stratix® 10 SX
  • Mfr:Altera
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz
  • Primary Attributes:FPGA - 850K Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:1760-BBGA, FCBGA
  • Supplier Device Package:1760-FBGA (42.5x42.5)

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1SX085HN3F43E3XG

Overview

The Altera 1SX085HN3F43E3XG is a Stratix 10 SX System on Chip FPGA featuring an embedded ARM Cortex-A53 processor. It provides 850,000 logic elements and 284,960 Adaptive Logic Modules within a 1760-ball FCBGA package. The device integrates 68 Mbit of embedded memory and supports up to 688 I/O pins. It includes 48 high-speed transceivers for advanced connectivity. The core logic operates at a voltage of 940 mV. The component is rated for industrial temperature ranges from -40°C to +100°C junction temperature.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 Hard Processor System with CoreSight debug infrastructure for unified software development.
  • Features high-density programmable fabric with significant embedded memory capacity for complex data processing tasks.
  • Supports high-speed serial communications through numerous integrated transceiver channels.

Applications

  • High-performance networking equipment requiring substantial packet processing capabilities.
  • Industrial automation systems utilizing embedded control processors alongside programmable logic.
  • Medical imaging hardware demanding high throughput and low latency signal processing.

Procurement Notes

Verify the specific suffix XG against official Intel/Altera documentation to confirm package and thermal specifications. Ensure compatibility with required PCB layout guidelines for flip-chip ball grid array assemblies. Confirm moisture sensitivity level handling procedures prior to assembly to prevent package damage during reflow soldering processes.

Selection Notes

Select this model when a balance of moderate logic density and embedded processing power is required. Compare against the HN2 variant if lower temperature or different voltage operation is needed. Evaluate the 1SG series if higher transceiver counts are necessary instead of embedded processor features.

Part Context

This component belongs to the Stratix 10 SX family, designed specifically for applications combining system-level processing with flexible logic. It shares the same physical package dimensions as other 1760-ball devices in the series but differs in internal resource allocation and processor integration compared to GX variants.

Replacement Considerations

Publicly confirmed direct substitute part numbers are not available in the provided source material. Verify pin-to-pin compatibility with existing designs before considering alternative densities within the Stratix 10 portfolio.

1SX085HN3F43E3XG1SX085HN3F43E3XG
$6,909.70
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