2308B-5HPGG8

2308B-5HPGG8

  • Description:IC MULT ZDB 16TSSOP
  • Series:-

SKU:5a623e1350f2 Category: Brand:

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Product Detailed Parameters

  • Description:IC MULT ZDB 16TSSOP
  • Series:-
  • Package:Tape & Reel (TR)
  • Mfr:Renesas Electronics Corporation
  • PLL:Yes with Bypass
  • Input:LVTTL
  • Output:LVTTL
  • Number of Circuits:1
  • Ratio - Input:Output:1:08
  • Differential - Input:Output:No/No
  • Frequency - Max:133.3MHz
  • Divider/Multiplier:Yes/No
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package:16-TSSOP
  • Type:Multiplier, Zero Delay Buffer

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2308B-5HPGG8

Overview

The Renesas Electronics Corporation 2308B-5HPGG8 is a zero-delay clock multiplier IC belonging to the 2308B series. It operates on a single 3.3V supply and features an LVCMOS input with eight LVCMOS outputs. The device supports input frequencies ranging from 10 MHz to 133 MHz, generating output frequencies up to 133.3 MHz. Packaged in a 16-pin TSSOP (PGG16) format, it exhibits a maximum center-to-center jitter of 200 ps peak-to-peak and an output skew of 250 ps. The component functions within a commercial temperature range of 0°C to +70°C.

Feature Summary

  • Zero-delay buffer architecture providing simultaneous input-output switching
  • Single 3.3V power supply operation with LVCMOS compatibility
  • Frequency multiplication capability supporting inputs up to 133 MHz
  • Low jitter performance with a maximum specification of 200 ps p-p

Applications

  • High-speed digital signal processing systems requiring precise clock distribution
  • Telecommunications equipment utilizing synchronous data transmission
  • Computer motherboards and peripheral interfaces needing low-skew clocking
  • Test and measurement instruments demanding stable frequency generation

Part Context

This component is part of the IDT/Renesas 2308B family of zero-delay buffers. These devices are engineered to eliminate propagation delay between the reference input and the buffered outputs. The specific suffix 'HPGG8' denotes the high-performance variant housed in a 16-lead Thin Shrink Small Outline Package (TSSOP), optimized for surface-mount assembly in space-constrained designs.

Replacement Considerations

Direct replacements within the same family include the 2308B-1HPGGI and 2308B-4DCG8. Verification of package dimensions and electrical tolerances against the original design specifications is required before substitution.

2308B-5HPGG82308B-5HPGG8

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