25CPC700BB3B66

Overview

The IBM 25CPC700BB3B66 is a specialized integrated circuit functioning as a Dynamic RAM (DRAM) memory controller and PCI bridge. It operates within a supply voltage range of 3.135V to 3.465V and supports an operating temperature range from -40°C to 105°C (TJ). The component utilizes a CBGA package with dimensions of 25x32 mm, featuring 474 pins. This device is designed for high-speed data transfer applications requiring robust memory management and peripheral connectivity.

Feature Summary

• Integrates DRAM memory control functions with PCI bridging capabilities
• Supports multiple PCI lanes for high-speed data transfer
• Designed for low power consumption in embedded systems

Applications

• Server memory subsystems
• Industrial control systems requiring PCI connectivity
• Embedded computing platforms

Procurement Notes

Verify the specific revision level and pin compatibility before integration. Confirm that the PCB layout supports the CBGA package dimensions and thermal requirements. Ensure the power supply design strictly adheres to the specified voltage range of 3.135V to 3.465V to prevent operational instability or damage to the component during deployment.

Selection Notes

Select this component when a combined DRAM controller and PCI bridge solution is required for space-constrained designs. Consider the thermal performance limits up to 105°C junction temperature. Evaluate the need for multiple PCI lanes and ensure the system architecture aligns with the integrated memory controller specifications for optimal data throughput.

Part Context

This part belongs to IBM's specialized interface and controller family, focusing on memory and peripheral management. It addresses the need for consolidated functionality in systems where separate memory controllers and bridges would increase board complexity. The design emphasizes reliability and efficiency for demanding operational environments.

Replacement Considerations

No direct public substitute part numbers are confirmed for this specific IBM model. Alternative solutions may require redesigning the memory interface and PCI logic due to unique architectural integration.