2N6325

Overview

The Microchip Technology 2N6325 is a hermetically sealed silicon planar Zener diode designed for high-reliability applications. It features a nominal Zener voltage of 10 V with a tolerance of ±5%. The device operates in the B-SQ-MELF-2 surface-mount package, offering a power dissipation rating of 500 mW. Key electrical characteristics include a maximum reverse leakage current of 1 µA and a Zener impedance of 6 Ω at the test current. It supports an operating temperature range from -65 °C to +175 °C, ensuring stability in extreme environments.

Feature Summary

• Hermetically sealed construction for enhanced environmental protection
• High thermal stability suitable for extreme temperature ranges
• Low leakage current for precision regulation
• Surface-mount MELF package for automated assembly

Applications

• Military aerospace voltage reference circuits
• High-reliability industrial power supplies
• Avionics protection networks
• Spacecraft instrumentation regulation

Procurement Notes

Verify the specific suffix code against the manufacturer's official datasheet to confirm exact electrical tolerances and testing levels. Ensure procurement channels provide traceability documentation required for military or aerospace specifications. Confirm RoHS status as some variants may be exempt due to material constraints. Validate package authenticity through authorized distributors only.

Selection Notes

Select this component when hermetic sealing and extended temperature operation are mandatory. Compare Zener impedance and leakage specifications against circuit requirements for noise-sensitive designs. Ensure the MELF footprint matches the PCB layout constraints. Verify that the 500 mW power rating accommodates peak dissipation scenarios without exceeding thermal limits.

Part Context

This part belongs to the standard Zener diode family produced by Microchip Technology. It utilizes silicon planar technology for consistent performance. The MELF packaging style distinguishes it from axial leaded equivalents, facilitating surface-mount integration while maintaining ruggedness comparable to traditional glass-encapsulated devices.

Replacement Considerations

Consult the official Microchip cross-reference guide for verified substitutes. Generic replacements may lack the required hermetic seal or temperature range. Verify pinout compatibility and electrical parameter equivalence before substitution.