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The Microchip Technology 2N6988 is a quad PNP silicon switching transistor configured as a dual bipolar junction transistor (BJT) array. It operates with a maximum collector-emitter voltage of 60 V and a continuous collector current of 600 mA. The device dissipates up to 400 mW of power and maintains a low saturation voltage of 1.6 V at specified currents. Designed for surface-mount installation in a 14-FlatPack package, it supports an extended operating temperature range from -65°C to +200°C. The component features a minimum DC current gain of 100 at 150 mA and 10 V, ensuring reliable performance in high-temperature environments.
Verify the specific ordering suffix to confirm the exact package type and qualification level, as variations exist between standard commercial and military specifications. Confirm RoHS compliance status directly with the manufacturer, as certain variants may not meet modern environmental directives. Ensure the supplier provides valid traceability documentation for aerospace or defense procurement requirements.
Select this component when a quad PNP array is required for high-temperature environments exceeding standard commercial limits. The 14-FlatPack package suits space-constrained surface-mount designs. Verify that the 60 V collector-emitter rating aligns with the circuit's maximum voltage swings. Consider the 400 mW power dissipation limit relative to the expected thermal management capabilities of the printed circuit board layout.
The 2N6988 belongs to a family of multiple PNP silicon switching transistors qualified under MIL-PRF-19500/558. Related devices include the 2N6987 and 2N6987U, which share similar structural configurations but may differ in specific electrical parameters or qualification levels. This series is designed for rugged applications requiring reliable bipolar transistor performance in extreme conditions.
Direct substitutes include the JAN2N6988 and JANS2N6988, which maintain equivalent electrical characteristics and military qualification standards. Verify pinout compatibility and package dimensions before substitution to ensure mechanical fit within the existing assembly.