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2SA1318S-AA is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS PNP 50V 0.2A 3-NP. Review the specifications below when checking this part for your BOM.
The onsemi 2SA1318S-AA is a PNP silicon epitaxial planar transistor housed in the SOT-563 surface-mount package. It features a collector-emitter breakdown voltage of -50 V and a continuous collector current rating of -0.5 A. The device operates with a DC current gain (hFE) ranging from 100 to 400 at a collector current of -10 mA. Key electrical parameters include a collector-base breakdown voltage of -60 V, an emitter-base breakdown voltage of -5 V, and a maximum power dissipation of 200 mW. The component supports a junction temperature range from -55°C to +150°C and includes internal base resistors for simplified circuit integration.
Verify the specific suffix AA against the manufacturer's official datasheet to confirm pinout configuration and resistor values. Ensure the ordering part number matches the exact RoHS compliance status required for your manufacturing process. Cross-reference the package marking code with official documentation to prevent counterfeit components during procurement.
Select this component when a PNP transistor with integrated base resistors is required for logic interfacing. Compare the -50 V breakdown voltage and -0.5 A current limits against circuit requirements. Consider the SOT-563 thermal characteristics and power dissipation limits relative to the expected operating load and ambient temperature conditions.
This device belongs to onsemi's lineup of small-signal PNP transistors designed for general-purpose use. It is engineered for applications requiring reliable switching and amplification in consumer electronics and industrial control systems. The SOT-563 form factor provides a space-efficient solution for modern surface-mount technology production lines.
Consult official substitution guides for equivalent PNP transistors with similar voltage ratings and integrated resistance configurations. Verify that alternative packages maintain compatible thermal performance and pin assignments.
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