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2SA1727TLP is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is TRANS PNP 400V 0.5A CPT3. Review the specifications below when checking this part for your BOM.
The 2SA1727TLP is a PNP silicon epitaxial planar transistor manufactured by ROHM Semiconductor. It features a collector-emitter voltage (VCEO) of 400 V and a maximum DC collector current (IC) of 500 mA. The device has a power dissipation rating of 1 W at 25°C ambient temperature. Key electrical parameters include a DC current gain (hFE) ranging from 120 to 360, a transition frequency (fT) of 12 MHz minimum, and an emitter-base breakdown voltage (VEBO) of 7 V. It operates within a junction temperature range of -55°C to +150°C.
Verify the specific ordering suffix 'TLQ' or 'TLP' against the manufacturer's official documentation to confirm tape-and-reel packaging specifications. Confirm RoHS compliance status and REACH SVHC declarations directly from the latest datasheet revision. Ensure the component lifecycle status is reviewed, as availability may be restricted based on production schedules.
Select this component when designing circuits requiring high voltage handling capabilities exceeding standard low-voltage transistors. The 400 V rating makes it appropriate for flyback transformer drivers and high-side switching applications. Consider the 500 mA current limit and 1 W power dissipation constraints during thermal management planning to ensure reliable operation under load conditions.
This part belongs to ROHM's lineup of high-voltage PNP bipolar junction transistors designed for robust performance in demanding environments. It utilizes silicon epitaxial planar technology to achieve high breakdown voltages while maintaining stable current gain characteristics. The device is intended for use in consumer electronics and industrial equipment where high voltage isolation and switching efficiency are required.
Consult the official ROHM replacement guide for verified equivalents. Cross-reference key parameters such as VCEO, IC, and package type when evaluating alternative components to ensure circuit compatibility.
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