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305-080-521-502 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 80POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-080-521-502 is a standard card edge connector designed for dual-edge board insertion. It features 80 positions with a 3.96 mm (0.156 inch) pitch. The connector utilizes gold-plated copper alloy contacts and a green thermoplastic housing. It supports a current rating of 5 A and operates within a temperature range of -40°C to +105°C. The unit employs a solder pin termination style and includes an insulation resistance of 5 GOhms.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact plating thickness, housing color, and termination style. Ensure compatibility with the target printed circuit board thickness of 1.57 mm. Confirm RoHS compliance status through the latest product documentation before finalizing procurement orders.
Select this component when a dual-edge interface with 80 positions is required. The 3.96 mm pitch accommodates standard card edge designs. Verify that the application environment falls within the specified operating temperature range. Ensure the PCB layout supports the vertical panel mount installation style and solder pin termination method for proper mechanical fixation.
This part belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting configurations. The 305-080-521-502 variant specifically addresses high-pin-count applications requiring dual-edge engagement. It serves as a header receptacle for mating with corresponding card edge assemblies in electronic systems.
Cross-reference with other EDAC 305 series parts for alternative position counts. Check for compatible substitutes from other manufacturers offering identical 3.96 mm pitch dual-edge specifications. Verify mechanical dimensions and electrical ratings match the original design requirements before substitution.
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