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306-010-520-108 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 20POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-010-520-108 is a standard card edge connector receptacle featuring a single row of ten positions with a 3.96 mm (0.156 inch) contact spacing. Designed for vertical panel mount installation, it accommodates printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The connector utilizes gold-plated copper alloy contacts and a thermoplastic polyester insulator body. It supports a current rating of 5 A and operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against official EDAC documentation to ensure correct flange configuration and termination style. Confirm that the required pin count and spacing match the application's PCB layout constraints. Check for RoHS compliance status if environmental regulations apply to the final assembly. Ensure the selected variant matches the intended operating temperature range for the specific deployment environment.
Select this component when a single-row, 10-position interface is required for vertical mounting applications. The 3.96 mm pitch suits designs needing wider spacing between signal lines. Consider the 5 A current rating for power distribution needs within the connector limits. Evaluate the thermoplastic polyester housing for compatibility with soldering processes and environmental exposure conditions in the target system.
This part belongs to the EDAC 306 series of standard card edge connectors. The series offers various position counts and mounting options for general-purpose electronic interconnections. The 306 series is characterized by its durability and standardized dimensions, facilitating integration into diverse industrial and commercial hardware platforms requiring reliable board-to-panel connections.
No public confirmed substitute part numbers are available in the provided documentation.
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