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306-012-520-107 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 24POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-012-520-107 is a standard card edge connector featuring a single row of 12 positions with a 3.96 mm (0.156 inch) contact spacing. Designed for vertical panel mounting, it accommodates printed circuit boards with a nominal thickness of 1.57 mm (0.062 inch). The contacts are constructed from copper alloy and feature gold plating to ensure reliable signal transmission. Rated for 5 A current at temperatures ranging from -40°C to +105°C, the unit utilizes a thermoplastic insulator body and provides an insulation resistance of 5 GOhms.
Verify that the specific ordering suffix matches the required termination style and flange configuration. Confirm compliance with relevant environmental directives such as RoHS before finalizing procurement orders. Ensure compatibility with the target PCB thickness specification to guarantee proper mechanical fit and electrical performance during assembly.
Select this component when a low-profile, single-row connection is required for panels accepting 0.062-inch thick boards. Consider the 3.96 mm pitch for applications needing wider spacing between signals. Evaluate the thermal rating against the operating environment to ensure the thermoplastic housing remains stable under expected load conditions.
This part belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its robust construction and suitability for general-purpose electronic applications. It represents a standardized solution for connecting edge-board modules to main systems in various industrial and commercial sectors.
Cross-reference with other EDAC 306 series variants sharing identical pin counts and pitch dimensions. Verify that alternative parts maintain the same panel mount orientation and board thickness tolerance to ensure mechanical interchangeability without redesigning the host enclosure.
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