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306-013-500-158 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. model 306-013-500-158 is a standard card edge connector socket featuring 13 positions in a single row configuration. It utilizes a 2.54 mm (0.100 inch) pitch and accepts printed circuit boards with a nominal thickness of 1.57 mm. The contacts are constructed from copper alloy with gold plating to ensure reliable signal transmission. Rated for 3 A current, the component operates within a temperature range of -40 °C to +105 °C. It employs solder lug termination and features a thermoplastic polyester insulator body.
Verify that the target application requires a 13-position single-row configuration with a 2.54 mm pitch. Confirm compatibility with 1.57 mm board thicknesses before integration. Ensure thermal requirements align with the specified operating temperature limits. Cross-reference the gold contact plating specifications against environmental exposure needs. Validate panel mounting constraints against mechanical assembly drawings.
Select this component when a low-profile, single-row interface is required for standard thickness boards. Consider the 3 A current rating for power distribution capabilities. Evaluate the vertical orientation against available panel space. Compare insulation resistance values against high-voltage isolation requirements. Assess the thermoplastic polyester housing durability against chemical exposure.
This part belongs to the EDAC 306 series of edgeboard connectors. The series offers various position counts and spacing options. It complements other EDAC products like the 345 and 357 series. The 306 series focuses on standard pitch applications. It provides a reliable connection solution for modular electronic designs.
No public confirmed substitute part numbers are available.
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