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306-017-521-107 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 34POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 306-017-521-107 is a dual-edge female card edge connector from the 306 Series, designed for panel and through-hole mounting. It features 17 positions with a 0.156-inch (3.96mm) contact spacing and accepts non-specified dual-edge cards. The contacts are made of copper alloy with gold plating and utilize a cantilever type termination. The insulator body is green thermoplastic polyester, rated for operation between -40°C and +105°C.
Verify the specific flange characteristics and thread insert specifications against the official datasheet before procurement. Confirm that the required PCB thickness falls within the acceptable range for proper engagement. Ensure compliance with RoHS3 and REACH regulatory standards as documented by the manufacturer to meet environmental requirements for your application.
Select this component when a dual-edge female connector with 17 positions and 0.156-inch spacing is required. Consider the cantilever contact type for ease of insertion and removal. Verify that the operating temperature range of -40°C to +105°C meets your environmental conditions. Ensure the panel mount style aligns with your mechanical assembly constraints.
This part belongs to the EDAC 306 Series, which provides standard card edge connectors with 0.156-inch contact spacing. The series offers various position counts and mounting options, catering to diverse electronic interconnection needs across multiple industries including industrial, telecommunications, and consumer electronics applications.
Consult the official EDAC 306 Series ordering guide for compatible substitutes. Verify identical parameters such as position count, spacing, and contact type when selecting alternative parts. Cross-reference mechanical dimensions and mounting styles to ensure interchangeability without redesigning the host assembly.
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