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The EDAC Inc. 306-022-400-103 is a standard card edge connector from the 306 series, designed for vertical panel mounting applications. It features 22 positions with a contact spacing of 3.96 mm and accommodates a board thickness of 1.57 mm. The contacts are constructed from copper alloy with gold plating to ensure reliable signal transmission. Rated for 5 A current, the unit utilizes a thermoplastic insulator and offers an insulation resistance of 5 GOhms. It operates within a temperature range of -40 C to +105 C.
Verify component authenticity through authorized EDAC distributors or certified partners. Confirm RoHS compliance status and specific plating specifications against the official datasheet prior to integration. Ensure storage conditions maintain integrity of the gold contacts and thermoplastic housing. Validate that the selected variant matches the required pin count and pitch for the target PCB design.
Select this model when a single-row, vertical card edge interface is required with robust thermal performance. The 3.96 mm pitch suits larger form-factor boards, while the gold plating supports frequent mating cycles. Consider the panel mount style for chassis-integrated designs rather than board-to-board connections. Verify compatibility with the target card thickness and operating environment limits.
This component belongs to the EDAC 306 series, which specializes in standard density card edge connectors. The series provides various position counts and termination options to support diverse electronic assembly needs. The 306-022-400-103 specifically addresses requirements for 22-position interfaces with durable contact materials.
Cross-reference compatible parts within the EDAC 306 family for alternative position counts or termination styles. Verify dimensional compatibility and electrical ratings before substituting with other manufacturers' offerings.