SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The EDAC Inc. 306-025-521-104 is a standard card edge connector from the 306 series, designed for vertical panel mounting applications. It features a dual female configuration with 50 positions arranged in two rows. The connector utilizes a 0.156-inch (3.96 mm) contact spacing and accepts printed circuit boards with a nominal thickness of 0.062 inches (1.57 mm). Contacts are gold-plated copper alloy, rated for 5 A current at +105°C maximum operating temperature. The insulator body is made of thermoplastic material.
Verify the specific ordering suffix against official EDAC documentation to confirm exact pin count, row configuration, and plating specifications. Ensure compatibility with target PCB thickness tolerances before procurement. Confirm RoHS compliance status through manufacturer datasheets. Validate lead times directly with authorized distributors as availability may vary by region.
Select this component when a high-density dual-row connection is required for thick PCBs. The 3.96 mm pitch offers robust mechanical stability compared to finer pitches. Verify that the vertical mounting orientation aligns with chassis design constraints. Ensure the thermal rating meets the operational environment requirements.
This part belongs to the EDAC 306 series of standard card edge connectors. The series is characterized by its low-profile insulator body and single centerline row architecture per side. It serves as a reliable interface solution for board-to-board or board-to-backplane connections in demanding electronic environments.
Cross-reference with other EDAC 306 series variants sharing identical 50-position dual-edge specifications. Verify dimensional compatibility and contact spacing consistency before substitution.