306-031-421-101

Overview

The EDAC Inc. 306-031-421-101 is a standard card edge connector receptacle from the 306 series. It features 62 positions with a 0.156-inch (3.96 mm) pitch and supports dual-sided card edges. The connector utilizes tin-plated cantilever contacts made of copper alloy, rated for 5 A current. Designed for panel mount installation via through-hole solder termination, it accommodates board thicknesses between 0.054 and 0.070 inches. The housing is constructed from thermoplastic polyester, ensuring insulation resistance of 5 GOhms and operation within a temperature range of -40°C to +105°C.

Feature Summary

• Dual-sided female contact configuration for edgeboard insertion
• Cantilever spring contact design ensures reliable electrical engagement
• Thermoplastic polyester housing provides thermal stability and insulation
• Through-hole solder termination facilitates secure panel mounting

Applications

• Industrial control system backplanes
• Telecommunications equipment interconnects
• Test and measurement instrument modules
• Embedded computing hardware interfaces

Procurement Notes

Verify that the specific part number matches the required 62-position count and 3.96 mm pitch before ordering. Confirm that the tin plating finish aligns with your assembly process requirements, as gold alternatives exist in this series. Ensure compatibility with the specified PCB thickness range of 1.37 mm to 1.78 mm during mechanical integration planning.

Selection Notes

Select this component when a dual-sided card edge interface with a 3.96 mm pitch is required. The 5 A current rating and high insulation resistance make it suitable for general-purpose industrial applications. Consider the tin finish for cost-effective soldering processes compared to gold-plated variants found in other series configurations.

Part Context

This component belongs to the EDAC 306 series of standard card edge connectors. The series offers various position counts and pitch options to accommodate different board densities. The 306-031 variant specifically addresses mid-density requirements with its 62-position layout, balancing connectivity needs with physical footprint constraints in electronic assemblies.

Replacement Considerations

Cross-reference with EDAC 306-031-421-104 if gold plating is preferred over tin. Verify that alternative suppliers offer identical 3.96 mm pitch and dual-sided female contact geometry to maintain mechanical interchangeability.